Period: Annual Exhibition Area: 320,000 square exhibitors Number: 3500 Number of visitors: 160,000 people
Shenzhen International Industrial Exhibition DMP is organized by Qualcomm International Group. The exhibition, formerly known as DMP International Mold, Metal Processing, Plastics and Packaging Exhibition, was founded in 1999 and has undergone 21 years of development and has become an annual industrial exhibition in the field of industrial manufacturing. The next exhibition will be held at Bao'an Pavilion, Shenzhen International Convention and Exhibition Center, focusing on digital, intelligent, personalized innovative technologies and solutions for different industries.
The scope of the exhibits
Gold cutting and forming machine tools: five-axis/four-axis/three-axis processing center, gyro/vertical/horizontal processing center, drilling attack center, car milling composite processing center, metal laser cutting machine, punch, hydraulic press, shearer, bend Machines, reel machines, elbowing machines, laser marking machines, laser welding machines, lasers, other laser equipment, sheet metal molds, etc., milling machines, crimbers, CNC cribs, flat/heartless/outer/inner round grinders , honers, tool grinders, boring machines, sawing machines, fast-walking wire, mid-walking wire, slow-walking wire cutting machine, electric spark machine, knife handle, knife rod, knife holder, knife library, knife holder, knife tower, card plate, split disk / degree head, etc., 5G industrial chain parts, medical device parts, intercity high-speed rail parts, ultra-high-voltage parts, artificial intelligence parts, large data center equipment parts
Automotive manufacturing and components: automotive high-strength steel, sheet, pipe and rod materials, aluminum, magnesium, titanium and alloy materials, composite materials, power supply, ignition, starting, signal lighting, instrumentation and auxiliary electrical equipment
New materials new process color: stainless steel, titanium alloy, aluminum alloy, magnesium alloy, color coating plate, liquid metal and composite materials; Grinding, polishing, PVD, anode oxidation, micro-arc oxidation, electroplating, electrophoresis, spraying, engraving and other surface treatment process equipment, accessories, glass, microcrystalline glass and other materials;